Memory Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3
Memory Buffered memory type Unregistered (unbuffered) Internal memory 16 GB Memory form factor 260-pin SO-DIMM ECC No Memory clock speed 2133 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Internal memory 16 GB Memory form factor 260-pin SO-DIMM ECC No Memory clock speed 2133 MHz Internal memory type DDR4
35 V Memory channels Dual-channel ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for PC/server Memory form factor 240-pin DIMM CAS latency 9 Memory voltage 1
2 V Memory ranking 2 ECC Yes Memory clock speed 2400 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Backlight No Memory layout (modules x size) 1 x 32 GB Internal memory 32 GB Component for Server Memory form factor 288-pin DIMM CAS latency 17 Memory voltage 1
Memory Buffered memory type Registered (buffered) Internal memory 24 GB Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 24 GB Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3
Hypertec X8356A-HY (Legacy) memory module 16 GB DDR2 667 MHz ECC DDR2 Memory Buffered memory type UnregisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to